Intel has disclosed additional details of its subsequent-era Xeon Phi processor for excessive-efficiency computing (HPC), codenamed Knights Landing. It is because of be obtainable within the second half of 2015, alongside with a brand new interconnect material generally known as Intel Omni Scale.
The chipmaker confirmed off the updates to its Xeon Phi many built-in core (MIC) platform on the International Supercomputing Conference (ISC) 2014 convention in Leipzig, Germany.
Intel first announced Knights Landing at last year’s event, however gave away few details aside from that the chip can be a 14nm half, would have the ability to function as a standalone CPU quite than a co-processor, and would have built-in on-package deal reminiscence.
Now, Intel has disclosed that this chip can be based mostly on a model of the Silvermont core utilized in Intel’s Atom processors, with HPC enhancements together with a low-latency mesh for inter-core communication. The first business techniques with it are more likely to ship within the second half of 2015.
Knights Landing may also have “no less than as many compute cores” as the prevailing Xeon Phi merchandise, in response to Charles Wuischpard, vice chairman for Workstations and HPC in Intel’s Data Centre Group. This means at the very least sixty one cores, whereas rumours have already indicated it might in reality be a seventy two-core chip.
The first Knights Landing chips may have as much as 16GB of on-package deal reminiscence, which presents 5 occasions the bandwidth of DDR4 reminiscence, however that is anticipated to be along with DDR4 reminiscence on the motherboard, not changing it.
“One of the choke factors in lots of purposes used in the present day is I/S and reminiscence bandwidth, and that is particularly designed to take away that bottleneck,” Wuischpard defined.
Knights Landing will the truth is supply 3 times the efficiency of the present Knights Corner Xeon Phi product, providing over three teraflops in a single processor socket, Intel claimed.
However, with the Silvermont Atom cores it additionally continues Intel’s strategy to HPC, which is to maintain as a lot compatibility as attainable between its Xeon Phi structure and its present x86 chips with their large put in base of software program.
Knights Landing may also function a brand new interconnect material that will probably be built-in onto the chip, and which Intel is referring to as Omni Scale. This would be the material utilized in future Xeon Phi chips, in line with Wuischpard.
Intel just isn’t gifting away an excessive amount of element on Omni Scale but, however stated it’s totally different from the present True Scale material in Knights Corner, which is predicated on quad knowledge price (QDR) InfiniBand know-how, whereas sustaining software program compatibility.
It will use Intel’s Silicon Photonics fibre-optic know-how, and can embody a full suite of choices together with PCI Express adapters and change hardware. Intel will present an improve path from True Scale to Omni Scale, Wuischpard stated.
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